ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,384, issued on Oct. 20, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Method for manufacturing wiring substrate" was invented by Yasushi... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,385, issued on Oct. 20, was assigned to Unimicron Technology Corp. (Taoyuan City, Taiwan). "Circuit board structure and manufacturing metho... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,386, issued on Oct. 20, was assigned to LG ENERGY SOLUTION LTD. (Seoul, South Korea). "Circuit board assembly manufacturing method, circuit... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,387, issued on Oct. 20, was assigned to FUJI Corp. (Chiryu, Japan). "Liquid transfer device for forming liquid film on a surface of a trans... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,388, issued on Oct. 20, was assigned to Phoenix Pioneer Technology Co. Ltd. (Hsinchu County, Taiwan). "Package carrier core layer structure... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,389, issued on Oct. 20, was assigned to DAIWA Co. LTD. (Nagano, Japan). "Method for manufacturing wiring board or wiring board material" wa... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,390, issued on Oct. 20, was assigned to AT&S Austria Technologie & Systemtechnik AG (Leoben, Austria). "Component carrier with magnetic ele... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,391, issued on Oct. 20, was assigned to Delta Electronics (Shanghai) Co. Ltd. (Shanghai). "Insulation structure and electronic device" was ... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,392, issued on Oct. 20, was assigned to TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) (Stockholm). "Method and apparatus for temperature and humid... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,393, issued on Oct. 20, was assigned to EYE-FI HOLDINGS LLC (Las Vegas). "Flexible light-emitting diode board with edge structure for makin... Read More